Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate

Authors

Gil Nonato C. Santos, De La Salle University, Manila
K. Otake, De La Salle University, Manila
V. Ngo, De La Salle University, Manila
Ronald De Los Reyes, De La Salle University, Manila
Prane Mariel B. Ong, De La Salle University, Manila
Reuben V. Quiroga, De La Salle University, Manila
R. Maniquis, University of the Philippines Diliman
A. Amorsolo, University of the Philippines Diliman

College

College of Science

Department/Unit

Physics

Document Type

Conference Proceeding

Source Title

Proceedings of the Seventh OU-DLSU Academic Research Workshop

Publication Date

2006

Abstract

In this study, an electrodeless nickel bath uses a phosphor chemical reducing agent to deposit nickel coatings uniformly on a receptive surface such as copper without the use of applied current. The plating reaction depletes the bath of nickel and reducing agent that lowers the bath pH. In order to keep the bath components within the appropriate ranges, analysis of bath concentration with respect to time was performed for 20, 40, and 60 minutes. The JEOL 5300 Series Scanning Electron Microscope and Oxfords Energy Dispersive X-ray System was used to examine the surface and elemental characteristics of the plating.

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Recommended Citation

Santos, G. C., Otake, K., Ngo, V., De Los Reyes, R., Ong, P. B., Quiroga, R. V., Maniquis, R., & Amorsolo, A. (2006). Surface and elemental characterization of electrodeless plating of nickel and phosphor on copper substrate. Proceedings of the Seventh OU-DLSU Academic Research Workshop Retrieved from https://animorepository.dlsu.edu.ph/faculty_research/9327

Disciplines

Physics

Keywords

Plating baths; Plating

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