Challenges of folded flex substrates: Fold blister resolution on stacked packages

College

College of Science

Department/Unit

Physics

Document Type

Archival Material/Manuscript

Publication Date

2004

Abstract

A flash memory chip has been stacked on a processor chip to meet the requirements of high speed mobile applications processing. This required the use of flex cable as a substrate. Solder joints between chips are formed in a reflow process at

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Disciplines

Engineering Physics | Physical Sciences and Mathematics | Physics

Note

Abstract only

Keywords

Blister packs; Flexible packaging

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