Design for manufacturability: Package bulging solution path on folded stacked chip packages (FSCSP) high volume manufacturing

College

College of Science

Department/Unit

Chemistry

Document Type

Archival Material/Manuscript

Publication Date

2006

Abstract

This paper will showcase the value of design for manufacturability based on keen understanding of material properties and process interaction. This approach will be shown on the specific example of the bulging phenomenon seen in the substrates and film die attach interfaces of folded stacked chip scale packages (FSCSP); its solution path through process step definition and optimization on exxt generation chip scale packages.

html

Disciplines

Manufacturing

Note

Presented at the Intel Philippines Technical Symposium 2006

Keywords

Chip scale packaging

Upload File

wf_no

This document is currently not available here.

Share

COinS