Application of screen-printable, thermally conductive, B-stageable folding adhesive for FSCSP

Authors

Cheryll Lei E. Mahinay, Intel Technology Phils., Inc.
Drexel H. Camacho

College

College of Science

Department/Unit

Chemistry

Document Type

Document Patent

Publication Date

10-20-2005

html

Recommended Citation

Mahinay, C. E., & Camacho, D. H. (2005). Application of screen-printable, thermally conductive, B-stageable folding adhesive for FSCSP. Retrieved from https://animorepository.dlsu.edu.ph/faculty_research/5711

Disciplines

Manufacturing

Note

Invention disclosure form

Keywords

Chip scale packaging; Adhesives

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