Reduction of IC package warpage through finite element analysis and direct optimization
Added Title
IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (11th : 2019)
HNICEM 2019
College
Gokongwei College of Engineering
Department/Unit
Mechanical Engineering
Document Type
Conference Proceeding
Source Title
2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019
Publication Date
11-1-2019
Abstract
Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was set to predict the warpage of an active metal brazed (AMB) ceramic substrate composite material when undergoing thermal cycling during manufacturing. It was then coupled with the Direct Optimization module of Design Explorer. The DO changes dimensions and features in the composite material, within restrictions set, in search for the best configurations that will counter warpage. The results show that, when reducing warpage induced by channels or cuts on the AMB face, mirroring the channel patterns on the opposite side of the AMB reduces resulting warpage by 92%.
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Digitial Object Identifier (DOI)
10.1109/HNICEM48295.2019.9072881
Recommended Citation
Moran, R., Arriola, E., Emil Lim, N., Mercado, J., Dimagiba, R., Gonzaga, J., & Ubando, A. T. (2019). Reduction of IC package warpage through finite element analysis and direct optimization. 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019 https://doi.org/10.1109/HNICEM48295.2019.9072881
Disciplines
Mechanical Engineering
Keywords
Integrated circuits—Packaging; Finite element method
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