Effects of pores on crack propagation in sintered-silver die attach: A baseline model

College

Gokongwei College of Engineering

Department/Unit

Mechanical Engineering

Document Type

Conference Proceeding

Source Title

Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Publication Date

10-2023

Abstract

Innovations in semiconductor devices are rapidly increasing, allowing electronic devices to operate at higher temperatures and frequencies for improved performance and efficiency. Sintered silver is a promising interconnection technology that provides excellent electrical and thermal connections for high junction temperatures. However, sintered silver bond-lines are porous, typically containing 15% to 20% volume fraction. This study aims to investigate the effects of these pores on the mechanical reliability of the bond line. The simulations were conducted using ANSYS software with the SMART algorithm. Results of the baseline model indicate that the presence of pores reduces stress concentration on the crack tip. The location of the pore relative to the initial direction of the crack tip influences the crack growth path and stress distribution. These findings from the baseline model can be used to design a more complex simulation which includes the actual interconnection geometry with its normal operating conditions.

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Disciplines

Mechanical Engineering

Keywords

Silver—Reliability; Sinter (Metallurgy); Porous materials—Reliability

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