Date of Publication

2006

Document Type

Master's Thesis

Degree Name

Master of Science in Manufacturing Engineering

Subject Categories

Engineering

College

Gokongwei College of Engineering

Department/Unit

Manufacturing Engineering and Management

Thesis Adviser

Nilo Ti Bugtai

Defense Panel Chair

Homer S. Co

Defense Panel Member

Elmer P. Dadios
Pag-asa D. Gaspillo

Abstract/Summary

Analog Devices Inc. (ADI) has been a major supplier of accelerometer devices in hermetic packages used for crash detection and vehicle dynamic control in the automotive industry. A major market pull from the handheld customers makes it imperative to develop very thin plastic packaging solution for MEMS accelerometer.

This work details the development of a very thin plastic packaging solution for wafer- level-capped MEMS accelerometer device. A backgrinding process is developed to

successfully thin the wafer-level-capped MEMS accele ocess demonstrated to successfully thin down to 250um thickness. Capped MEMS wafers are prepared for manufacturing by using wafer protective tapes, manufacturing concerns and corresponding solutions are discussed. A 4x4x1mm3

Leadframe Chip Scale Package (LFCSP) is pr he thinned MEMS device. The performance of the thinned a e using the very thin packaging s l t d significant effect in performance is observed. An analytical m uations [14] is used to further under of very thin plastic packaging on thin MEMS accelerometer device.

Abstract Format

html

Language

English

Format

Electronic

Accession Number

CDTG004377

Shelf Location

Archives, The Learning Commons, 12F Henry Sy Sr. Hall

Physical Description

84 leaves ; 28 cm.

Keywords

Plastics in packaging; Microelectromechanical systems

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