Layered polymeric composite spacer for stacked chip scale packages

Authors

Drexel H. Camacho
Myra Tamayo

College

College of Science

Department/Unit

Chemistry

Document Type

Other

Publication Date

11-26-2005

html

Recommended Citation

Camacho, D. H., & Tamayo, M. (2005). Layered polymeric composite spacer for stacked chip scale packages. Retrieved from https://animorepository.dlsu.edu.ph/faculty_research/5712

Disciplines

Manufacturing

Note

Invention disclosure form

Keywords

Chip scale packaging

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