Title

Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging

College

Gokongwei College of Engineering

Department/Unit

Mechanical Engineering

Document Type

Conference Proceeding

Source Title

2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019

Publication Date

11-1-2019

Abstract

With the advancement of technology, semiconductor devices become more complex to satisfy the need for more features while reducing the size. For a component with varying material parts such as the semiconductor package, it is prone to warpage because of the different material properties present in the materials, mainly the thermal expansion coefficient. Package warpage emerge from varying temperatures from assembly processes which affects the performance of the device. This paper evaluates the product warpage by considering material selection through varying the material properties of different components. A validated model was employed using the material properties and dimensions from a previous study that compared a two-dimensional finite element model results to actual experimental data. The results have shown to be not significantly different from the two-dimensional model and experimental results. The developed model was then used to assess various material properties and identify the factors that could greatly affect the deformation in the semiconductor package. © 2019 IEEE.

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Digitial Object Identifier (DOI)

10.1109/HNICEM48295.2019.9073437

Disciplines

Mechanical Engineering

Keywords

Semiconductors—Defects; Ball grid array technology; Finite element method

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